THERMAL MANAGEMENT TECHNOLOGY

Thermal Management Technology Thermal Management or the ability of advanced electronic systems to dissipate the required heat loads has become a concern for anyone in the production of high performance electronic components. Heat has created a roadblock that traditional air cool systems have been unable to overcome.

Wolverine Micro-Cooling business unit is focused on the industry’s need for enhanced thermal management on ever-denser electronic circuit design.
Learn more about our thermal management, manufacturing process technology and get the Wolverine Tube’s Micro-Cooling team working on a comprehensive MDT solution to your electronic cooling requirement.

Additional Links:

Force Fed Boiling and Condensation for High Heat Flux Applications (PDF)

		Wolverine's Micro-Cool™ Evaporator and Condenser Testing Wolverine completes testing on its Micro-Cool™ evaporator and condenser in a major thermal management program with the University of Maryland, for the Office of Naval Research, that clearly demonstrates the thermal performance advantage of its MDT microchannel.

		Wolverine Expanded Its Process Capability Sy-Jenq Loong, Micro-Cooling™ Engineering Manager, has expanded the process capability for Wolverine’s proprietary Micro Deformation Process and the result is a larger library of enhanced surface geometries for thermal management solutions.

		Wolverine Expanded Its Business Thermal Management Capabilities Wolverine’s Micro-Cooling™ Division is in the process of expanding its business thermal management capability from simply fundamental MDT surfaces to full scale components with full design support, manufacturing, and assembly.