THERMAL PERFORMANCE

Liquid cooling systems designed with microchannel cold plates have significantly enhanced thermal heat transfer performance when compared to traditional smooth cold plate surfaces.

Wolverine’s Micro-Cooling team has initiated preliminary evaluation of MDT enhanced surfaces as a miniature heat sink for a novel air cooled system.

David Saums of DS&A, under contract with Wolverine. Mr. Saums is a well recognized consultant within the electronic cooling industry.

Mr. Saums has specific knowledge and perspective on a wide range of engineered material science relevant to the electronic cooling market. We welcome you to contact Mr. Saums and solicit his technical perspective on MDT capability.

Additional Links:
Below are independent studies highlighting the actual MDT performance advantage in a liquid cooling system.

High-Performance, Low-Cost Liquid Micro Channel Cooler Whitepaper
by Ralph Web, Penn State University (PDF)
A Self-Contained System for Thermal Management of Next Generation High Heat Flux Electronics Presentation
by Michael M. Ohadi, Ph.D. University of Maryland (PDF)
Force Fed Boiling and Condensation for High Heat Flux Applications (PDF)

		Wolverine's Micro-Cool™ Evaporator and Condenser Testing Wolverine completes testing on its Micro-Cool™ evaporator and condenser in a major thermal management program with the University of Maryland, for the Office of Naval Research, that clearly demonstrates the thermal performance advantage of its MDT microchannel.

		Wolverine Expanded Its Process Capability Sy-Jenq Loong, Micro-Cooling™ Engineering Manager, has expanded the process capability for Wolverine’s proprietary Micro Deformation Process and the result is a larger library of enhanced surface geometries for thermal management solutions.

		Wolverine Expanded Its Business Thermal Management Capabilities Wolverine’s Micro-Cooling™ Division is in the process of expanding its business thermal management capability from simply fundamental MDT surfaces to full scale components with full design support, manufacturing, and assembly.