MICROCOOL® THERMAL ANALYSIS

Microprocessors and IGBT modules around the world are being driven in multiple industries to higher process speeds, with continuous improvement demanded in size and weight with a ever present pressure to reduce overall system cost.  MicroCool® surface technology offers the OEM engineer and system integrator the optimum in design flexibility while maximizing both thermal performance and pressure drop.

If you have a thermal challenge with your electrical system, give us call and let a Wolverine Tube, MicroCool® engineering team model for you a host of MicroCool® approaches to resolve your liquid cooling challenge. 

We can quickly analyze your thermal and physical requirements, and together dial in the MicroCool® surface geometry that best meets your specification.  With proprietary MicroCool® tools and a solid base of application know-how, we can evaluate with CFD modeling tools and actual empirical testing validate the best design for your specific application. 

We will evaluate:

• Thermal Resistance
• Pressure drop
• Balance your flow and thermal performance
• Analyze the specific physical geometry of the fin design
• Recommend the appropriate refrigerant or fluid
• Double check the flow velocity
• Make recommendations on corrosion resistance and erosion
• Analyze the appropriate fin gap to minimize fouling
• Recommend fittings, gaskets, o-rings, etc. for higher performance and reliability