MICROCOOL® EXHIBITING AT PCIM ASIA 2017
Decatur, Ala., May 22, 2017 — Wolverine’s MicroCool® Division will be exhibiting at this years PCIM ASIA conference, which will take place June 27-29, 2017 in Shanghai (Pudong). The company will be showcasing their products at Booth B24. PCIM Asia is an international conference and exhibition focusing on power electronics. The event, similar to PCIM Europe, allows the industry to see the latest developments in power electronic components and systems. Sy-Jenq Loong, General Manager of MicroCool Division, will be presenting at the Exhibitor Forum on June 27th at 2:40 PM outlining the latest breakthroughs in liquid cooled cold plates.
MicroCool® is an industry leader in designing and engineering base plate, cold plate and total cooling loop system designs. The company offers a myriad of fin and custom pin fin geometries designed to improve reliability and thermal efficiency in cooling electronic systems. These unique cold plates maximize thermal and pressure drop performance due to enhanced surface area, high fin density and distinctive micro-channel construction. MicroCool® will be showcasing its existing line of standard 2000 and 3000 series IGBT cold plates. The cold plates uses the company’s patented Micro Deformation Technology (MDT™) and typically have friction stir welded (FSW) leak-proof seals.
Wolverine’s MicroCool® Division provides industry-leading solutions for base plate, cold plate and total cooling loop system designs for computer systems and high-performance power electronics. For more information about MicroCool®, please visit: www.microcooling.com.