Base Plate Products

High Performance Base Plates

High-power modules require excellent thermal performance and dependability, therefore adequate cooling is critical for reliable operation. MicroCool® offers excellent thermal dissipation for high power electronic components by offering a series of high performance base plates.

Semi-conductor chips or isolating substrates can be soldered directly to the MDT base plate eliminating the thermal interface layer (TIM), the largest thermal barrier in a power electronic package.

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