MicroCool Clad

We have a global License Agreement with Infineon Technologies AG for the development, manufacture, and sale of its new MicroCool Clad IGBT base plate. MicroCool Clad combines all of the advantages of Micro Deformation Technology (MDT) with a customized clad metal (patent pending) substrate to create its newest IGBT product innovation. 

MicroCool CLAD technology provides Infineon and other IGBT module manufactures around the world several advantages including:

• Improved corrosion protection and reliability when used with an aluminum manifold as seen in most automotive inverter applications
• Lighter overall weight
• Lower overall metal cost to traditional copper. No need for nickel plating
  Proprietary technology
• Direct cooling of the base plate eliminates the need for a thermal interface material between the base plate and cold plate, reducing a large part of the overall system thermal resistance.