MicroCool Clad

MicroCool® has a global License Agreement with Infineon Technologies AG for the development, manufacture, and sale of its new MicroCool® Clad IGBT base plate. MicroCool® Clad combines all of the advantages of Micro Deformation Technology (MDT) with a customized clad metal (patent pending) substrate to create its newest IGBT product innovation.

MicroCool® CLAD technology provides Infineon and other IGBT module manufactures around the world several advantages including:

  • Improved corrosion protection and reliability when used with an aluminum manifold as seen in most automotive inverter applications
  • Lighter overall weight
  • Lower overall metal cost to traditional copper. No need for nickel plating
    Proprietary technology
  • Direct cooling of the base plate eliminates the need for a thermal interface material between the base plate and cold plate, reducing a large part of the overall system thermal resistance.


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