2000 Series Standard Cold Plates
Our standard liquid cooled IGBT and CPU cold plates are designed to fit most of the common IGBT and Power electronics configurations used today. At the heart of each cold plate is our patented Micro Deformation Technology (MDT™) in line pin fin, Friction stir welded construction, and CFD optimized parallel cooling.
If these “off the shelf” standard cold plates do not meet your requirements, please contact us to discuss semi-custom and custom cold plate options to meet the needs of your specific application.
Which cold plate best fits your application?
Check out our IGBT Cross Reference Guide
CP2000 Series Options
MDT In Line Pin Fin options:
4mm tall STD inline pin (1mm dia/gap)
4mm tall XP inline pin (.5mm dia/gap)
- Fitting Options: 3/8th NPT – G3/8th – SAE-6 Cold plate length options: We can cut extrusions to any length to accommodate more or less IGBT modules.
- Double-sided and long versions available:
- Internal electroless nickel plating for fluid compatibility.
IGBT Cross Reference Table for CP 2000 Series
| Product Name | Module Size | Module Name | Module Name | Module Name | Module Name |
|---|---|---|---|---|---|
| CP 2001 | 3X 122x62 | Infineon EconoDUAL | Semikron SEMIX | PowerEx NX | |
| CP 2002 | 1X 122x162 | Infineon EconoPACK | Semikron SEMIX33 | PowerEx Intellimod | Fuji M629 |
| CP 2003 | 1X SKIM 93 | Semikron SKIM93 | |||
| CP 2004 | 1X SKIM 63 | Semikron SKIM63 | |||
| CP 2005 | 3X Prime Pack 3 | Infineon PrimePACK3 | Fuji M272 | ||
| CP 2006 | 3X Mega Dual | PowerEx Mega Power Dual | Mega Dual | ||
| CP 2007 | 1X 140x190 | ABB HiPAK | Fuji M152/156 | ||
| CP 2008 | 1X 140x130 | ABB HiPAK | Fuji M256/M278 | ||
| CP 2009 | 3X 62x108 | Infineon 62mm | Semikron SEMITRANS | Fuji M127/M234/M235 | MicroSemi SP6/D3/D4 |
| CP 2010 | 3X Prime PACK 2 | Infineon PrimePACK2 | Fuji M271 |
