MicroCool Cap
Two methods for construction:
- The IGBT module can be built/soldered on the Clad fin plate then welded in after. We need at least 10mm of aluminum surrounding the copper pad so we do not damage the power electronics during the FSW process
- The IGBT module can be build/soldered to the sealed and welded cold plate by simply soldering to the copper pads. The welded boxed cold plate structure is extremely stiff an resists bending leading to less stress on the DBC and power electronics.
