Technical Publications
Published Technical Articles
A new base plate concept on the basis of aluminum copper and clad materials
MicroCool Cold Plate Information
PCIM Abstract – Liquid Cooling Power Electronics Closer to the Heat Source
High-Performance, Low-Cost Liquid Micro Channel Cooler Whitepaper
by Ralph Web, Penn State University (PDF)
Force Fed Boiling and Condensation for High Heat Flux Applications (PDF)
IBM Technical Article Cooling Energy Hungry Data Centers, IBM Research-Zurich, Science Magazine
Advanced Liquid Cooling for a Traction Drive Inverter Using Jet Impingement and Microfinned Enhanced Surfaces (PDF), National Renewable Energy Laboratory (NREL), Presented at ITherm 2014
Published Presentations
Download our General Presentation
MicroCool PCIM Presentation (2016)
MicroCool General Presentation
MicroCool – iMAPS France Presentation
Peformance Difference Between MicroCool MDT – ILPF and Forged Round Pins
A Self-Contained System for Thermal Management of Next Generation High Heat Flux Electronics Presentation
by Michael M. Ohadi, Ph.D. University of Maryland (PDF)
Relevant Test Series
Forced-Fed Micro Channel Heat Transfer for High Flux Heat Cooling, University of Maryland, Department of Mechanical Engineering
Fraunhofer Microcooler Characterization by Andreas Schletz, Markus Rauch
Thermal and Hydrodynamic Analysis of the Experimental Results with 13 Wolverine Cold Plates by Prof. John Thome
